Company Filing History:
Years Active: 2022
Title: The Innovative Contributions of William Spies
Introduction
William Spies is an accomplished inventor based in Arvada, Colorado. He has made significant contributions to the field of three-dimensional imaging technology. His innovative approach has led to the development of a unique method and system for surface measurement using mobile devices.
Latest Patents
William Spies holds a patent for a "Method and system for three-dimensional surface measurement with a mobile device." This patent describes a three-dimensional (3D) imaging system that utilizes a mobile device equipped with a display screen. The device is designed to project a series of patterns onto an object intended for imaging. Additionally, it features a front-facing camera that captures reflections of these patterns from the object. The system includes a controller that manages the timing of the patterns displayed and the activation of the camera, ensuring precise imaging.
Career Highlights
William Spies is affiliated with Northwestern University, where he continues to advance his research and development efforts. His work in the field of imaging technology has garnered attention for its practical applications and innovative design.
Collaborations
William has collaborated with notable colleagues, including Florian Willomitzer and Oliver Strider Cossairt. Their combined expertise has contributed to the success of various projects and innovations in imaging technology.
Conclusion
William Spies exemplifies the spirit of innovation through his contributions to three-dimensional imaging technology. His patent and collaborative efforts highlight the importance of creativity and teamwork in advancing scientific knowledge.