Endicott, NY, United States of America

William S Ebert


Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 84(Granted Patents)


Company Filing History:


Years Active: 1984-2001

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4 patents (USPTO):

Title: The Innovative Contributions of William S. Ebert

Introduction

William S. Ebert is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of technology, particularly in computer interfaces and testing apparatuses. With a total of 4 patents to his name, Ebert's work has had a lasting impact on the industry.

Latest Patents

Ebert's latest patents include a "Computer interface for integrating a first computer into a second computer." This invention features an enclosure designed to fit into multiple slots of a first type computer, housing a computer subsystem from a second type computer. The design ensures seamless integration and functionality between different computer systems. Another notable patent is the "Test apparatus for circuitized substrate." This apparatus is designed for testing circuitized substrates, such as printed circuit boards, and utilizes elastomeric members to ensure a positive connection during testing. The innovative design allows for quick separation and repositioning of substrates, enhancing efficiency in testing processes.

Career Highlights

William S. Ebert is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to collaborate with some of the brightest minds in the industry, contributing to advancements in technology and innovation.

Collaborations

Ebert has worked alongside talented colleagues, including Michael B. Brown and Leonard T. Olson. Their collaborative efforts have further propelled the development of innovative technologies within their field.

Conclusion

William S. Ebert's contributions to technology through his patents and work at IBM highlight his role as a significant inventor. His innovative designs continue to influence the industry and pave the way for future advancements.

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