William R Conley

Title: Innovations by William R. Conley

Introduction

William R. Conley is a notable inventor based in Tijeras, New Mexico. He has made significant contributions to the field of microelectronics, holding three patents that focus on innovative methods for protecting and packaging microelectronic devices. His work is essential for advancing technology in this specialized area.

Latest Patents

Conley's latest patents include a method for applying temporary coatings to protect microelectronic devices during packaging. This invention involves applying a water-insoluble, temporary protective coating to sensitive areas of the device, performing packaging steps, and then removing the coating, preferably through dry plasma etching. The protective coating can be made from various materials, including parylene polymer, silicon nitride, and other combinations. Another significant patent involves a method for pre-release plastic packaging of MEMS and IMEMS devices. This method encapsulates the MEMS device in a transfer molded plastic package and includes steps for perforation and non-ablative material removal processes, ensuring the protection of fragile components during packaging.

Career Highlights

William R. Conley is associated with Sandia Corporation, where he applies his expertise in microelectronics. His innovative approaches have contributed to the development of advanced packaging techniques that enhance the reliability and performance of microelectronic devices.

Collaborations

Conley collaborates with Kenneth A. Peterson, leveraging their combined expertise to push the boundaries of microelectronic technology. Their partnership has led to advancements in the field, particularly in the area of MEMS devices.

Conclusion

William R. Conley's work exemplifies the importance of innovation in microelectronics. His patents and contributions significantly impact the industry, ensuring the protection and efficiency of microelectronic devices during packaging.