Rochester, NY, United States of America

William L DeMarco


Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 44(Granted Patents)


Location History:

  • Great Meadows, NJ (US) (1978)
  • Rochester, NY (US) (2001 - 2005)

Company Filing History:


Years Active: 1978-2005

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9 patents (USPTO):Explore Patents

Title: Innovations by William L DeMarco

Introduction

William L DeMarco is a notable inventor based in Rochester, NY (US). He has made significant contributions to the field of technology, holding a total of 9 patents. His work primarily focuses on methods that enhance the efficiency and accuracy of die formation processes.

Latest Patents

Among his latest patents, DeMarco has developed a "Method of using an overlay to verify or form a folding, embossing, or rule die." This innovative method involves creating an imaged receiver sheet with an image, a first thermal print layer, and a support layer. The process includes laminating a plastic sheet with the imaged receiver sheet, removing the support layer, and using the resulting overlay to verify or form a die. Another significant patent is the "Method for using an overlay to form a rule die," which outlines a similar process but focuses on forming a rule die specifically.

Career Highlights

DeMarco is currently associated with Eastman Kodak Company, where he applies his expertise in developing advanced technologies. His work has been instrumental in improving the manufacturing processes within the company.

Collaborations

Throughout his career, DeMarco has collaborated with talented individuals such as Roger Stanley Kerr and Seung H Baek. These partnerships have contributed to the successful development of his innovative ideas.

Conclusion

William L DeMarco's contributions to the field of technology through his patents and collaborations highlight his role as a significant inventor. His innovative methods continue to influence the industry and pave the way for future advancements.

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