Waynoka, OK, United States of America

William L Chapman


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2004

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of William L. Chapman

Introduction

William L. Chapman is an accomplished inventor based in Waynoka, Oklahoma. He is known for his significant contributions to electrical safety through his innovative designs. His work focuses on creating solutions that enhance the safety and functionality of electrical receptacles.

Latest Patents

Chapman holds a patent for "Arc-safe electrical receptacles." This invention is designed to eliminate arc faults rather than merely detect them, which can lead to circuit disconnection. The arc-safe receptacles are low-cost and child-safe, making them particularly useful in residential settings. They can be fitted within single gang enclosures and are applicable in both residential and industrial environments. The invention aims to increase the safe use of electrical receptacles, particularly in homes, while also reducing industrial liabilities. The safety receptacles prevent arcing during the insertion, residence, and removal of plugs, even under substantial load.

Career Highlights

William L. Chapman is associated with Redgate Technologies, Inc., where he continues to innovate in the field of electrical safety. His work has garnered attention for its practical applications and potential to improve safety standards in electrical installations.

Collaborations

Some of his notable coworkers include Anthony R. Carson and Robert E. Redgate, who contribute to the collaborative environment at Redgate Technologies, Inc. Their combined expertise fosters innovation and the development of cutting-edge solutions in electrical technology.

Conclusion

William L. Chapman exemplifies the spirit of innovation in electrical safety through his patented designs. His contributions not only enhance safety but also pave the way for future advancements in the field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…