Company Filing History:
Years Active: 1987-1992
Title: The Innovations of William J. Slattery
Introduction
William J. Slattery is a notable inventor based in Essex Junction, Vermont, who has made significant contributions to the field of semiconductor technology. With a total of 4 patents to his name, Slattery's work focuses on improving the reliability and efficiency of semiconductor packages.
Latest Patents
One of his latest patents is titled "Planarized Thin Film Surface Covered Wire Bonded Semiconductor Package." This invention addresses the conductive path between the semiconductor chip and the lead frame via wires. It enhances the bond between the wires and the lead frame members, creating additional contacts even if the bonded contact fails. The method involves placing an insulating layer on the active surface of each chip, which carries input and output bonding pads. This layer is a thermosetting adhesive that, when subjected to lamination force, crushes the wires against their respective pads and leads, thereby improving contact and reducing defects in conductivity.
Another significant patent is the "Method of Making a Planarized Thin Film Covered Wire Bonded." This method similarly focuses on improving the bond between the wires and the lead frame. By utilizing an insulating layer, it ensures that the wires maintain a strong connection to their respective leads, enhancing the overall reliability of the semiconductor chip.
Career Highlights
William J. Slattery is currently associated with the International Business Machines Corporation (IBM), where he continues to innovate in the semiconductor field. His work has been instrumental in advancing technologies that are critical to modern electronics.
Collaborations
Throughout his career, Slattery has collaborated with notable colleagues, including H. Ward Conru and Gary H. Irish. These collaborations have contributed to the development of groundbreaking technologies in the semiconductor industry.
Conclusion
William J. Slattery's contributions to semiconductor technology through his patents and work at IBM highlight his role as a key innovator in the field. His inventions not only improve the functionality of semiconductor packages but also pave the way for future advancements in electronics.