Company Filing History:
Years Active: 1987
Title: The Innovations of William J King, Jr.
Introduction
William J King, Jr. is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of materials science, particularly in the development of brazing alloys for electronic applications. His work has implications for the efficiency and reliability of electronic chip carriers.
Latest Patents
One of King’s key patents is for a high melting point copper-gold-tin brazing alloy specifically designed for chip carriers. This invention addresses the challenges of brazing elements to electronic chip carrying substrates, which require materials that maintain strength at elevated temperatures. The patent details a process where Au:Sn brazing alloys are modified with copper to enhance the formation of the higher melting point .beta. phase of the alloy. Additionally, a Group VIII metal is incorporated to draw Sn out of the melt, promoting the formation of the .beta. phase and thickening the braze material. This innovative approach is crucial for the reliable attachment of flanges and pins in electronic devices.
Career Highlights
William J King, Jr. has spent a significant portion of his career at International Business Machines Corporation (IBM). His work at IBM has allowed him to collaborate with leading experts in the field and contribute to groundbreaking advancements in electronic materials.
Collaborations
Throughout his career, King has worked alongside notable colleagues such as Norman G Ainslie and Joseph M Harvilchuck. These collaborations have fostered an environment of innovation and have led to the successful development of new technologies in the industry.
Conclusion
William J King, Jr. is a distinguished inventor whose work in brazing alloys has made a lasting impact on the electronics industry. His innovative approaches continue to influence the development of reliable electronic components.