Buffalo Grove, IL, United States of America

William J Ballad


Average Co-Inventor Count = 3.5

ph-index = 4

Forward Citations = 129(Granted Patents)


Company Filing History:


Years Active: 1994-2016

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5 patents (USPTO):Explore Patents

Title: Discovering the Innovations of William J. Ballad

Introduction

William J. Ballad is a notable inventor based in Buffalo Grove, Illinois, with a remarkable portfolio that includes five patents. His latest inventions focus on enhancing the functionality and durability of acoustic systems, specifically earphone assemblies designed with moisture resistance.

Latest Patents

One of William's latest patents is an earphone assembly with moisture resistance. This innovative acoustic system incorporates a conduit and a microphone coupled to one end, while a rigid moisture-resistant barrier is attached to the other end. This barrier is designed to prevent moisture from traveling along the conduit towards the receiver, effectively maintaining audio integrity. It boasts a submersion rating of at least 7 on the Ingress Protection (IP) scale.

Another patent similarly focuses on earphone assemblies with moisture resistance. In this design, an acoustic system includes a receiver or microphone, a tube, and a moisture-resistant screen. The screen is strategically fitted at the end of the tube to prevent moisture from moving towards the receiver while also dampening the audio signal. This invention is configured to achieve a submersion rating equal to or greater than 7 IP, showcasing William’s commitment to delivering high-quality, reliable audio equipment.

Career Highlights

William J. Ballad is currently associated with Knowles Electronics, Inc., a prominent company known for its expertise in micro-acoustic microphones and advanced audio solutions. His work focuses on the development of innovative products that cater to the evolving needs of the audio industry, especially in the face of environmental challenges.

Collaborations

Throughout his career, William has collaborated with talented professionals such as Timothy K. Wickstrom and Ying-Tzu Chan. These partnerships have enriched his inventions, allowing for the fusion of ideas and expertise that enhance the functionality and performance of the products they develop.

Conclusion

William J. Ballad's contributions to the field of acoustic technology exemplify the intersection of innovation and practical application. His patents not only address the challenges posed by moisture in electronic devices but also highlight the importance of continued development in enhancing user experience in audio technology. Through his work with Knowles Electronics, Inc. and collaboration with skilled colleagues, William continues to push the boundaries of acoustic engineering, paving the way for future advancements in the industry.

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