Santa Rosa, CA, United States of America

William Hollender


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: William Hollender: Innovator in Printed Circuit Board Technology

Introduction

William Hollender is a notable inventor based in Santa Rosa, CA (US). He has made significant contributions to the field of electronics, particularly in the design and functionality of printed circuit boards (PCBs). His innovative approach has led to the development of a unique multi-layered PCB that enhances both performance and usability.

Latest Patents

Hollender holds a patent for a multi-layered printed circuit board having core layers that include indicia. This invention features a stack of core layers arranged one over another, with electrically conductive interconnects extending vertically through the stack. Each core layer consists of a substrate with opposite major surfaces, an electrically conductive active trace on at least one major surface, and an indicium. The stack has an exposed edge that reveals the indicia of the layers, providing identifying and fiducial information about the PCB. This innovation is crucial for improving the functionality and identification of PCBs in various applications. He has 1 patent to his name.

Career Highlights

William Hollender is currently employed at Keysight Technologies, Inc., where he continues to push the boundaries of PCB technology. His work at this leading technology company has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his coworkers include Brian Wade Carlson and Donald Ingram, who contribute to the innovative environment at Keysight Technologies, Inc. Their collective expertise fosters advancements in electronic design and manufacturing.

Conclusion

William Hollender's contributions to printed circuit board technology exemplify the spirit of innovation in the electronics industry. His patented designs not only enhance the functionality of PCBs but also pave the way for future advancements in the field.

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