Company Filing History:
Years Active: 2006-2008
Title: Innovations by William F Eckenwiler
Introduction
William F Eckenwiler is an accomplished inventor based in Ortonville, MI (US). He has made significant contributions to the field of packaging design and optimization. With a total of 2 patents, Eckenwiler's work focuses on enhancing the efficiency of packaging processes.
Latest Patents
Eckenwiler's latest patents include a "System, method, and storage medium for determining a packaging design for a container." This innovative method involves selecting at least one 3-D CAD model of a manufactured part and generating multiple 3-D part packaging designs for a container. The process ensures that the packaging design is optimized for the specific dimensions of the container. Another notable patent is the "Method and apparatus for manufacturing packaging optimization." This simulation program determines the most efficient packaging configuration for placing parts or assemblies into selected shipping containers, facilitating the transfer of products to customer plants.
Career Highlights
Eckenwiler is currently employed at Delphi Technologies, Inc., where he applies his expertise in packaging design and optimization. His work has contributed to advancements in the efficiency of packaging processes, benefiting both manufacturers and consumers.
Collaborations
Eckenwiler has collaborated with notable colleagues, including Philip Verdura and Jayson D Pankin. These partnerships have fostered innovation and creativity in their projects.
Conclusion
William F Eckenwiler's contributions to packaging design and optimization demonstrate his commitment to innovation in the field. His patents reflect a deep understanding of the complexities involved in packaging processes, making him a valuable asset in the industry.