Company Filing History:
Years Active: 2001-2004
Title: The Innovations of William E. Spink
Introduction
William E. Spink is a notable inventor based in Harrisburg, PA, with a focus on electrical connectors. He holds two patents that showcase his expertise in creating innovative solutions for electrical connections.
Latest Patents
One of his latest patents is for a high-density connector. This invention comprises a receptacle housing with a base wall and at least one lateral wall defining a cavity. The lateral wall is designed to nest within a plug housing. A high-density array of female electrical contacts is arranged in the cavity, supported in the base wall and extending unsupported above the base wall to a specified height. Additionally, a single-piece protection member is arranged in the cavity adjacent to the base wall, featuring an array of openings through which the electrical contacts extend. The protection member is designed with a thickness that ensures the electrical contacts do not extend beyond its outer face. Another significant patent is for an electrical connector that facilitates connections to a circuit board and receives module cards and operating circuit cards. This connector includes a dielectric housing with adjacent card-receiving areas, first and second electrical contacts for connecting to conductive members of both the module card and the operating circuit card.
Career Highlights
Throughout his career, William E. Spink has worked with several companies, including FCI Americas Technology Inc. and The Whitaker Corporation. His contributions to these organizations have been instrumental in advancing electrical connector technology.
Collaborations
William has collaborated with notable coworkers such as L. Robin Johnson and Kevin E. Walker, further enhancing his innovative work in the field.
Conclusion
William E. Spink's contributions to electrical connector technology through his patents and career achievements highlight his significant role as an inventor. His work continues to influence the industry and pave the way for future innovations.