Company Filing History:
2 out of 30,052 
2 out of 164,219 
Years Active: 1999
Title: The Innovations of William Davies
Introduction
William Davies is an accomplished inventor based in Pleasant Valley, NY (US). He holds a total of 2 patents that showcase his expertise in semiconductor technology. His innovative contributions have made a significant impact in the field.
Latest Patents
Davies' latest patents include the development of integrated multi-layer test pads and methods therefor. This invention features a multi-layer test pad on a semiconductor wafer, which consists of an underlying matrix of interconnected first pads arranged in rows and columns. The design incorporates an oxide layer above the underlying matrix and between the rows and columns. Additionally, an overlying matrix of interconnected second pads is positioned above the oxide layer. Each of the second pads completely overlaps at least nine of the first pads, including four oxide regions surrounding a center first pad of the nine. The arrangement of the nine first pads forms a 3x3 block.
Career Highlights
Throughout his career, William Davies has worked with notable companies such as Siemens Aktiengesellschaft and IBM. His experience in these organizations has contributed to his development as an inventor and innovator in the technology sector.
Collaborations
Some of his coworkers include Frank Alswede and Ronald Hoyer, who have collaborated with him on various projects.
Conclusion
William Davies is a notable inventor whose work in semiconductor technology has led to significant advancements. His patents reflect his innovative spirit and dedication to improving technology.