Company Filing History:
Years Active: 2010-2016
Title: Innovations of William D. Houck
Introduction
William D. Houck is an accomplished inventor based in Blacksburg, VA (US). He has made significant contributions to the field of microstructures, holding a total of four patents. His work focuses on the development of advanced materials and structures that have practical applications in technology.
Latest Patents
William D. Houck's latest patents include innovative designs for three-dimensional microstructures. One of his patents describes a three-dimensional microstructure featuring a first dielectric element and a second multi-layer metal element configured to define a non-solid volume. This invention outlines methods for forming microstructures that are useful in coaxial transmission lines for electromagnetic energy. Another patent focuses on three-dimensional microstructures with a re-entrant shape aperture, also detailing methods of formation and their applications in similar technological fields.
Career Highlights
Throughout his career, William has been associated with Nuvotronics, LLC, where he has contributed to the advancement of microstructural technologies. His expertise in sequential build processes has enabled the creation of microstructural elements that are affixed to one another, enhancing the functionality of various electronic components.
Collaborations
William D. Houck has collaborated with David W. Sherrer, working together to push the boundaries of innovation in their field.
Conclusion
William D. Houck's contributions to the field of microstructures exemplify the impact of innovative thinking in technology. His patents reflect a commitment to advancing materials that enhance electronic applications.