Ennis, TX, United States of America

William C Robinette


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Innovations by William C. Robinette

Introduction

William C. Robinette is an accomplished inventor based in Ennis, Texas. He has made significant contributions to the field of electronics packaging through his innovative methods. His work focuses on enhancing the production of insulated conductive through-features in core materials.

Latest Patents

William C. Robinette holds 1 patent for his invention titled "Methods to produce insulated conductive through-features in core." This patent discloses methods for producing insulated, conductive through-features in conductive core materials specifically designed for electronics packaging. The invention employs protective mask technology to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. This innovative approach creates a conductive through-feature that completely transverses the core of the substrate board. Additionally, the invention provides planar substrates for multilayer printed circuit boards or chip carriers, which comprise the conductive through-features produced by these methods.

Career Highlights

William C. Robinette is associated with Ormet Corporation, where he applies his expertise in electronics packaging. His work has contributed to advancements in the field, particularly in the development of efficient and effective methods for producing conductive features in electronic components.

Collaborations

William has collaborated with notable colleagues, including Pradeep R. Gandhi and Samuel Fu. Their combined efforts have furthered the innovation landscape in electronics packaging.

Conclusion

William C. Robinette's contributions to the field of electronics packaging through his innovative methods have paved the way for advancements in technology. His work continues to influence the industry and showcases the importance of innovation in electronics.

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