Company Filing History:
Years Active: 2000
Title: The Innovative Contributions of William Burdett
Introduction
William Burdett is an accomplished inventor based in the County of Armstrong, PA (US). He has made significant contributions to the field of manufacturing, particularly in the production of laminated parts. His innovative approach has led to the development of a unique method that enhances the efficiency and accuracy of manufacturing processes.
Latest Patents
William Burdett holds a patent for a "Method for manufacturing laminated part using a die contained sensing." This patent describes an apparatus and method for manufacturing laminated parts from a plurality of laminas. The laminas are blanked from strip stock material, cut, and stacked to form the final laminated part. The apparatus includes a measuring device integrated with the die element of the press, which accurately measures the thickness of successive sections of the strip stock. A controller, such as a computer or a programmable logic controller, receives the thickness values from the measuring device. Additionally, the system includes means activated by the controller to provide compensation adjustments at selected locations on the strip stock sections, counteracting measured thickness variations and controlling the stack height. This innovative method has the potential to improve manufacturing precision and reduce waste.
Career Highlights
William Burdett is currently employed at Oberg Industries, where he applies his expertise in manufacturing and innovation. His work at Oberg Industries has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of his notable coworkers include John F Powell, II and Samuel A Rummel. Their collective efforts contribute to the advancement of manufacturing technologies and processes.
Conclusion
William Burdett's innovative methods and dedication to improving manufacturing processes have made a significant impact in his field. His patent for manufacturing laminated parts showcases his ability to combine technology and practical application, paving the way for future advancements.