Pittsford, NY, United States of America

Wiliam P Belias


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2010-2012

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2 patents (USPTO):Explore Patents

Title: Wiliam P. Belias: Innovator in Polymeric Bag Technology

Introduction

Wiliam P. Belias is a notable inventor based in Pittsford, NY (US). He has made significant contributions to the field of polymeric bag technology, holding 2 patents that showcase his innovative approach to solving practical problems.

Latest Patents

His latest patents focus on polymeric bags with pressure relief valves. The design includes first and second opposing body panels attached along a pair of opposing sides and a bottom bridging the sides. A reclosable fastener extends along a mouth formed opposite the bottom, and a pressure relief opening is defined in the first body panel. The pressure relief valve is attached to the first body panel and features a cover member that includes an upper layer and a lower layer. The lower layer has a first portion attached to the body panel and a second portion that is contiguous but not attached to the body panel. The upper layer is hingedly connected to the second portion of the lower layer, effectively covering the pressure relief opening. An additional aspect of the design includes a seal line extending proximate to the pressure relief opening.

Career Highlights

Wiliam P. Belias has established himself as a key figure in his field through his work at Pactiv Corporation. His innovative designs have contributed to advancements in packaging technology, particularly in enhancing the functionality of polymeric bags.

Collaborations

He has collaborated with notable coworkers such as James S. Blythe and Toby R. Thomas, further enriching the innovative environment at Pactiv Corporation.

Conclusion

Wiliam P. Belias continues to be a driving force in the development of polymeric bag technology, with his patents reflecting a commitment to innovation and practical solutions. His work not only enhances product functionality but also contributes to the broader field of packaging technology.

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