Wilfried Reschnar

Title: Wilfried Reschnar: Innovator in Diffusion-Soldered Joints

Introduction

Wilfried Reschnar is a notable inventor based in Ilsfeld, Germany. He has made significant contributions to the field of materials engineering, particularly in the area of soldering technology. His innovative approach has led to the development of a unique method for creating diffusion-soldered joints.

Latest Patents

Reschnar holds a patent for a "Diffusion-soldered joint and method for making diffusion-soldered joints." This invention features a particularly actively diffusing, low-melting-point intermediate layer, which is applied in a molten state. The method involves introducing a solder carrier between at least two joint components. The solder carrier consists of a metal foil that is equipped on both sides with solder layers, which may include multiple layers.

Career Highlights

Throughout his career, Wilfried Reschnar has focused on advancing soldering techniques and improving joint reliability. His work has been instrumental in enhancing the performance of various applications that rely on diffusion-soldered joints. With a total of 1 patent, he has established himself as a key figure in this specialized field.

Collaborations

Reschnar has collaborated with notable colleagues, including Rolf Mayer and Rolf Engelhart. These partnerships have contributed to the development and refinement of his innovative soldering methods.

Conclusion

Wilfried Reschnar's contributions to the field of diffusion-soldered joints exemplify his commitment to innovation and excellence in materials engineering. His patented methods continue to influence the industry and pave the way for future advancements.