Wenping Dai

Title: Innovations by Wenping Dai in Component Carrier Technology.

Introduction

Wenping Dai is a notable inventor based in Singapore, SG. He has made significant contributions to the field of component carrier technology. His innovative work has led to the development of a unique patent that addresses the manufacturing of component carriers.

Latest Patents

Wenping Dai holds a patent titled "Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures." This patent describes a component carrier related body that includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures. It also features at least two information carrying structures that are formed vertically displaced on at least two different layer structures. Notably, at least two of these information carrying structures are laterally displaced in a plan view on the stack. This innovation enhances the traceability and functionality of component carriers in various applications.

Career Highlights

Wenping Dai is currently employed at AT&S (China) Co. Ltd., where he continues to push the boundaries of technology in his field. His work at AT&S has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in component carrier manufacturing.

Collaborations

Some of his notable coworkers include Seok Kim Tay and Azmi Ibrahim. Their collaborative efforts have further enriched the innovative environment at AT&S, fostering a culture of creativity and technological advancement.

Conclusion

Wenping Dai's contributions to component carrier technology through his patent and work at AT&S (China) Co. Ltd. highlight his role as a key innovator in the industry. His advancements are paving the way for future developments in this critical area of technology.