Wenguan Li

Title: Wenguan Li: Innovator in Chip Cooling Technology

Introduction

Wenguan Li is a notable inventor based in Zhanjiang, China. He has made significant contributions to the field of chip cooling technology, showcasing his innovative spirit through his patented inventions. His work is particularly relevant in the context of modern electronics, where efficient cooling solutions are essential for optimal performance.

Latest Patents

Wenguan Li holds a patent for a "Chip cooling platform based on micro-nano structure." This invention includes a platform body, a cooling pipeline, and an outer heat dissipation device. The cooling pipeline is designed in a closed-loop structure, with part of it integrated into the platform body. It is filled with a cooling medium, and features a turbulence structure on the inner wall of the cooling pipeline located within the platform body. Additionally, a unidirectional hydraulic pump is installed on the cooling pipeline outside the platform body, while the outer heat dissipation device is responsible for radiating the cooling medium. This innovative design aims to enhance the efficiency of chip cooling systems.

Career Highlights

Wenguan Li is affiliated with Guangdong Ocean University, where he continues to advance his research and development efforts. His academic background and professional experience have positioned him as a key figure in the field of micro-nano technology.

Collaborations

Wenguan Li collaborates with talented colleagues, including Haowei Li and Weijun Feng. Their combined expertise fosters a productive research environment, leading to innovative solutions in their respective fields.

Conclusion

Wenguan Li's contributions to chip cooling technology exemplify the importance of innovation in the electronics industry. His patented designs not only address current challenges but also pave the way for future advancements in thermal management solutions.