Location History:
- Shenzhen, CN (2018 - 2019)
- Shanghai, CN (2018 - 2021)
Company Filing History:
Years Active: 2018-2021
Title: The Innovative Contributions of Wenbing Tang
Introduction
Wenbing Tang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of thermal management in electronic devices. With a total of 4 patents to his name, his work focuses on enhancing the efficiency of heat dissipation in various applications.
Latest Patents
Wenbing Tang's latest patents include innovative designs aimed at improving thermal dissipation. One of his notable inventions is a mixed heat sink fins system for better thermal dissipation used in electrical products. This electronic device features a heat-dissipation device that comprises an airflow channel, an airflow source, and a plurality of elongated heat-dissipation fins. Additionally, it includes heat-dissipation flow-guiding devices strategically arranged to optimize airflow and enhance cooling efficiency. Another significant patent involves a holder and mobile terminal that incorporates a heat conduction area and a heat insulation area. This design effectively reduces heat at the edge of the holder, improving user comfort and device performance.
Career Highlights
Wenbing Tang has worked with prominent companies in the technology sector, including Huawei Device and Harman International Industries. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic device design and functionality.
Collaborations
Throughout his career, Wenbing has collaborated with talented individuals such as Xiangyang Yang and Linfang Jin. These partnerships have fostered a creative environment that has led to the development of cutting-edge technologies.
Conclusion
Wenbing Tang's contributions to thermal management in electronic devices highlight his innovative spirit and dedication to improving technology. His patents reflect a commitment to enhancing user experience and device efficiency.