Chung Li, Taiwan

Wen Chung Liu

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2009-2010

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2 patents (USPTO):Explore Patents

Title: Innovations of Wen Chung Liu

Introduction

Wen Chung Liu is a notable inventor based in Chung Li, Taiwan. He has made significant contributions to the field of wireless communication technology. With a total of 2 patents to his name, Liu's work focuses on enhancing the efficiency and functionality of communication devices.

Latest Patents

Liu's latest patents include a System-in-package wireless communication device comprising a prepackaged power amplifier. This invention features a substantially rectangular shaped power amplifier module that includes a power amplifier for amplifying radio frequency signals. The module is designed with a bias control terminal and a power sensing terminal on the same side as the power amplifier, along with an input terminal and a ground terminal. Additionally, it has an output terminal and one or more power supply terminals, all positioned on the same side of the power amplifier module.

Career Highlights

Wen Chung Liu is currently associated with Micro Mobio Corporation, where he continues to innovate in the field of wireless communication. His work has been instrumental in developing advanced communication technologies that cater to modern needs.

Collaborations

Liu collaborates with talented individuals such as Ikuroh Ichitsubo and Kanya Kubota, who contribute to the innovative environment at Micro Mobio Corporation.

Conclusion

Wen Chung Liu's contributions to wireless communication technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in communication devices.

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