Wei-Ping Zheng

Title: Wei-Ping Zheng: Innovator in Modular Circuit Design

Introduction

Wei-Ping Zheng is a notable inventor based in Brooklyn, NY. He has made significant contributions to the field of circuit design, particularly through his innovative approach to modular assembly packages. His work emphasizes cost reduction and enhanced performance in electronic components.

Latest Patents

Wei-Ping Zheng holds a patent for a "Miniature low cost modular assembly package and method of assembly." This invention features a modular miniature circuit built entirely within the case of the module, eliminating the need for a primary printed circuit board. The circuit components are mounted directly inside the case, with leads attached to the module's terminals. This design greatly reduces lead inductance, resulting in a substantial decrease in cost and physical size. Additionally, the reduction in lead lengths significantly enhances high-frequency performance. The 'flip chip' construction allows for a flat surface suitable for automatic assembly equipment, further minimizing costs.

Career Highlights

Wei-Ping Zheng is associated with Scientific Component, Inc., where he applies his expertise in circuit design. His innovative solutions have positioned him as a valuable asset in the field of electronics.

Collaborations

Wei-Ping Zheng has worked alongside talented colleagues such as Shi-Lang Yang and Dhiren Bhatt. Their collaborative efforts contribute to the advancement of technology in their respective areas.

Conclusion

Wei-Ping Zheng's contributions to modular circuit design exemplify innovation in the electronics industry. His patent reflects a commitment to improving efficiency and reducing costs in electronic components.