Title: Wei-nung Hsu: Innovator in Brittle Object Cutting Technology
Introduction
Wei-nung Hsu is an inventor based in Taipei, Taiwan. He is currently associated with Nanoplus GmbH, where he focuses on developing innovative technologies. Although he has not yet been granted any patents, his work in the field of brittle object cutting is noteworthy.
Latest Patent Applications
Wei-nung Hsu's latest patent application is titled "Brittle Object Cutting Apparatus and Cutting Method Thereof." This application discloses a brittle object cutting apparatus that includes a first heating laser unit, a second heating laser unit, a scribing laser unit, two cooling units, and a processing module. The apparatus is designed to enhance the efficiency of cutting brittle objects. The heating lasers are positioned on opposite sides of the scribing laser, while the cooling units follow the heating lasers. The processing module controls the scribing operation and manages the heating and cooling processes. This innovative approach aims to significantly reduce the machining time required for dicing brittle objects.
Conclusion
Wei-nung Hsu is making strides in the field of brittle object cutting technology, showcasing his potential as an inventor. His latest patent application reflects his commitment to innovation and efficiency in this specialized area.