Chongqing, China

Wei Lai


Average Co-Inventor Count = 10.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Wei Lai: Innovator in Power Component Testing

Introduction

Wei Lai is a prominent inventor based in Chongqing, China. He has made significant contributions to the field of power components, particularly in testing methodologies. His innovative approach has led to the development of a unique patent that addresses critical aspects of power component reliability.

Latest Patents

Wei Lai holds a patent titled "Method for testing and evaluating short-circuit withstand capability of press-pack power component." This patent discloses a comprehensive method for assessing the short-circuit withstand capability of press-pack power components. The method involves building a test platform and obtaining various parameters such as voltage level, pressure load, environmental temperature, and maximum junction temperature fluctuation range of the component under actual working conditions. The process includes real-time monitoring of changes in short-circuit current, collector-emitter voltage, and grid-emitter voltage until failure occurs due to a short circuit. The relationships between voltage, pressure, temperature, and short-circuit withstand capability are thoroughly analyzed.

Career Highlights

Wei Lai is affiliated with Chongqing University, where he continues to advance research in power electronics. His work has garnered attention for its practical applications in enhancing the reliability of power components. With a focus on innovation, he has established himself as a key figure in his field.

Collaborations

Wei Lai collaborates with notable colleagues, including Hui Li and Renkuan Liu. Their combined expertise contributes to the advancement of research and development in power component technologies.

Conclusion

Wei Lai's contributions to the field of power component testing exemplify the importance of innovation in engineering. His patented method not only enhances the understanding of component reliability but also paves the way for future advancements in power electronics.

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