Company Filing History:
Years Active: 2010
Title: Wei Kong: Innovator in Adhesive Technologies
Introduction
Wei Kong is a notable inventor based in Slough, GB. He has made significant contributions to the field of adhesive technologies, holding a total of 2 patents. His work focuses on developing innovative adhesives that enhance performance and usability in various applications.
Latest Patents
Wei Kong's latest patents include a "Low application temperature elastic attachment adhesive" and "Absorbent articles comprising a radiation cured hot melt positioning adhesive." The first patent describes low application temperature thermoplastic hot melt adhesives that serve as elastic attachment adhesives. These adhesives exhibit a viscosity at 275°F of less than about 8,000 cp, a yield stress of less than about 80 psi, and a creep performance for a bond made through strand coating of less than about 15%. Preferred adhesives have a creep performance for a bond made through spiral coating of less than about 25%. The second patent presents an article that includes an adhesive attachment region comprising a radiation curable hot melt pressure-sensitive adhesive.
Career Highlights
Wei Kong is currently employed at Henkel AG & Company, KGaA, where he continues to innovate in adhesive technologies. His work has been instrumental in advancing the capabilities of adhesives used in various industries.
Collaborations
Wei has collaborated with notable colleagues such as Qiwei He and Michael G. Harwell, contributing to the development of cutting-edge adhesive solutions.
Conclusion
Wei Kong's contributions to adhesive technologies through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of adhesive applications.