Midland, MI, United States of America

Wayne R Hutter


Average Co-Inventor Count = 2.4

ph-index = 4

Forward Citations = 37(Granted Patents)


Company Filing History:


Years Active: 1977-1987

Loading Chart...
6 patents (USPTO):Explore Patents

Title: Wayne R Hutter: Innovator in Multiwall Valve Bag Technology

Introduction

Wayne R Hutter is a notable inventor based in Midland, MI (US). He has made significant contributions to the field of packaging technology, particularly in the development of methods and machines for filling and sealing multiwall valve bags. With a total of 6 patents to his name, Hutter's innovations have had a considerable impact on the industry.

Latest Patents

One of Hutter's latest patents is a method and machine for filing and sealing a multiwall valve bag. This invention involves a bag that is fabricated with a valve structure consisting of at least two separated layers of a polymer composition. These layers are capable of being heated by electromagnetic energy in the radio frequency range (RF energy). Once the bag is filled with a product, the valve structure is clamped against electrodes carrying RF energy. This process allows the polymer layers to absorb enough RF energy to join together, effectively heat sealing the filled bag. Another notable patent is a thermoplastic panel designed for storing thermal energy storage material.

Career Highlights

Hutter is currently employed at The Dow Chemical Company, where he continues to innovate and develop new technologies. His work has been instrumental in advancing packaging solutions that enhance efficiency and product integrity.

Collaborations

Throughout his career, Hutter has collaborated with talented individuals such as Paul J Moses and James E Kosinski. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Wayne R Hutter's contributions to the field of packaging technology exemplify his innovative spirit and dedication to improving industry standards. His patents reflect a commitment to advancing methods that enhance product packaging and storage.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…