Company Filing History:
6 out of 25 
1 out of 832,880 Years Active: 2017-2023
Title: Wayne Cooper Smith: Innovator in Semiconductor Cleaning Technologies
Introduction
Wayne Cooper Smith, an accomplished inventor based in Reno, NV, is recognized for his significant contributions to the field of semiconductor device handling through his seven patents. His innovative ideas focus primarily on enhancing cleaning systems for critical equipment used in the semiconductor manufacturing process.
Latest Patents
Wayne's latest patents include a sophisticated "Pick and Place Machine Cleaning System and Method." This invention introduces a mechanism and methodology designed for the regular cleaning of vacuum apertures, nozzles, and surfaces of pick-and-place apparatuses. The device utilizes a cleaning pad layer featuring intermediate layers with specific characteristics and geometrical designs to enhance its efficacy.
Another notable patent is for a "System and Method for Cleaning Wire Bonding Machines Using Functionalized Surface Microfeatures." This invention presents a unique cleaning material tailored for the capillary tube of wire bonding machines. The cleaning pad, with its specific design, aims to ensure efficient cleaning during normal operations, leveraging a substrate with a defined functionalized surface topology.
Career Highlights
Wayne has been involved with several esteemed companies throughout his career, including International Test Solutions, Inc. His work at these organizations has significantly contributed to advancements in semiconductor technology, particularly in cleaning and maintenance systems.
Collaborations
Throughout his career, Wayne has collaborated with experienced professionals, including Alan Eugene Humphrey and Bret A Humphrey. These collaborative efforts have fostered innovation and advancement in the technical domains they address.
Conclusion
Wayne Cooper Smith remains a pivotal figure in the realm of semiconductor innovations. With his focus on improving cleaning systems for critical machinery, his patents illustrate his commitment to enhancing manufacturing efficiency and reliability. His work continues to shape the landscape of semiconductor device handling technologies.