Company Filing History:
Years Active: 2000
Title: Wayne Chu - Innovator in Wettable Polypropylene Composition
Introduction
Wayne Chu is a notable inventor based in Tarrytown, NY (US). He has made significant contributions to the field of materials science, particularly in the development of wettable polypropylene compositions. His innovative work has led to the creation of a patented composition that enhances the properties of polypropylene.
Latest Patents
Wayne Chu holds a patent for a "Wettable polypropylene composition and related method of manufacture." This invention involves a wettable polypropylene composition that includes polypropylene and a hydrophilic, polar compound. The composition is designed to have a contact angle of less than or equal to 75 degrees, making it suitable for various applications. The hydrophilic polar compounds used in this composition include maleic anhydride-modified polypropylene, acrylic acid modified polypropylene, and polyethylene glycol, among others. This innovative approach allows for improved wettability and functionality of polypropylene materials.
Career Highlights
Wayne Chu is currently employed at International Paper Company, where he continues to work on advancements in material compositions. His expertise in polymer science and engineering has positioned him as a valuable asset to his team and the company. His dedication to innovation is evident in his research and development efforts.
Collaborations
Wayne has collaborated with esteemed colleagues such as Prasad Shrikrishna Potnis and Ashok M Adur. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the advancement of technology in their field.
Conclusion
Wayne Chu's contributions to the field of polypropylene compositions exemplify the spirit of innovation. His patented work not only enhances the properties of materials but also showcases the importance of collaboration in scientific advancements. His ongoing efforts at International Paper Company continue to push the boundaries of material science.