Suwon-si, South Korea

Watanabe Ryoichi

USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Watanabe Ryoichi: Innovator in Printed Circuit Board Technology

Introduction

Watanabe Ryoichi is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electronics, particularly in the development of printed circuit boards. His innovative approach has led to advancements that enhance the functionality and efficiency of electronic devices.

Latest Patents

Watanabe holds a patent for a printed circuit board that includes a via pad with concavo-convex patterns. This invention provides a circuit pattern formed on a first insulating layer, with a via pad that is spaced apart from the circuit pattern. The via pad features a cross section larger than that of the via hole and incorporates concavo-convex patterns. Additionally, the invention includes a second insulating layer formed on the via pad and a copper foil layer that enhances the overall structure. This patent showcases Watanabe's commitment to improving electronic components.

Career Highlights

Watanabe Ryoichi is currently employed at Samsung Electro-Mechanics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology in printed circuit boards.

Collaborations

Watanabe has worked closely with his coworker, Se Won Park, to further develop innovative solutions in the field of electronics. Their collaboration has led to advancements that benefit the industry and enhance product performance.

Conclusion

Watanabe Ryoichi's contributions to printed circuit board technology exemplify his innovative spirit and dedication to the field. His patent and work at Samsung Electro-Mechanics Co., Ltd. highlight his role as a key player in advancing electronic components.

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