Tao-Yuan, Taiwan

Wang-Nang Wang


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: Innovations of Wang-Nang Wang in Cryogenic Adhesives

Introduction: Wang-Nang Wang is a notable inventor based in Tao-Yuan, Taiwan. He has made significant contributions to the field of adhesive technology, particularly in the development of cryogenic adhesives. His innovative work has led to the creation of a unique adhesive composition that performs exceptionally well at low temperatures.

Latest Patents: Wang holds a patent for "Cryogenic adhesives made from epoxy terminated urethanes." This two-part adhesive composition boasts superior adhesive strength at cryogenic temperatures. The formulation includes a urethane resin composition part and a hardener part. The urethane resin composition consists of 50 to 99% by weight of a modified polyurethane prepolymer with epoxy groups at each end, and 1 to 50% by weight of a modified urethane compound that has no ether cyanate (NCO) groups and at least two epoxy groups per molecule, with a molecular weight of less than 800 daltons. The hardener part is a polyamine containing primary or secondary amine groups, with an equivalent ratio of amine groups to epoxy groups ranging from 0.5 to 2.0.

Career Highlights: Wang-Nang Wang is associated with China Technical Consultants, Inc., where he has been instrumental in advancing adhesive technologies. His expertise in cryogenic applications has positioned him as a key figure in the industry.

Collaborations: Wang has collaborated with notable colleagues, including Der-Shyang Chen and Hung-Chung Hsia. Their combined efforts have contributed to the success of various projects in adhesive development.

Conclusion: Wang-Nang Wang's innovative work in cryogenic adhesives showcases his expertise and commitment to advancing adhesive technology. His contributions are significant in ensuring the reliability of adhesives in extreme conditions.

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