Company Filing History:
1 out of 282 
1 out of 14 Years Active: 1997
Title: Walter Findl - Innovator in Compression Glass Lead-In Arrangements
Introduction
Walter Findl is a notable inventor based in Vienna, Austria. He is recognized for his innovative contributions to the field of semiconductor technology. His work primarily focuses on the development of lead-in arrangements that enhance the performance and reliability of integrated circuits.
Latest Patents
Walter Findl holds a patent for a "Compression Glass Lead-In Arrangement." This invention involves a compression glass lead-in arrangement within a metal body, particularly for metal housings used in semiconductors. The design ensures that the interior of the housing is hermetically sealed from the environment. A glass bead is fused into a bore in the housing, allowing the connecting conductor of the integrated circuit to pass outward through the glass. The use of alloys such as copper, aluminum, and magnesium during the cooling phase after fusing provides a hardening effect. This innovation results in compression glass lead-in arrangements that maintain hermetic sealing integrity even under high thermal and mechanical stress, while also exhibiting excellent resistance to temperature fluctuations and corrosion.
Career Highlights
Throughout his career, Walter Findl has made significant contributions to the field of electrical engineering. He has worked with reputable companies, including Diehl GmbH & Co. and Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft. His expertise in semiconductor technology has positioned him as a valuable asset in the industry.
Collaborations
Walter Findl has collaborated with various professionals in his field, including Wolfgang Hornig. Their joint efforts have contributed to advancements in semiconductor technology and the development of innovative solutions.
Conclusion
Walter Findl's work in compression glass lead-in arrangements has made a lasting impact on the semiconductor industry. His innovative approach to enhancing the reliability and performance of integrated circuits showcases his dedication to advancing technology.