Inuyama, Japan

Wakato Tomatsu

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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7 patents (USPTO):Explore Patents

Title: Wakato Tomatsu: Innovator in Multilayer Packaging Solutions.

Introduction

Wakato Tomatsu is a prominent inventor based in Inuyama, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative multilayer body designs. With a total of 7 patents to his name, Tomatsu continues to push the boundaries of what is possible in food packaging.

Latest Patents

Among his latest patents, Tomatsu has developed a multilayer body that offers favorable thermal dimensional stability. This invention allows for the creation of food-packaging bags that do not require perforations or guiding lines through laser half-cutting. The design minimizes resistance when opening the package by tearing, ensuring that only a small extent of parting occurs. Additionally, a step is formed between the opening ends on the front and back sides, making it easier to access the contents. Another notable patent involves a polyolefin-based resin film that includes a unique resin composition, which enhances the film's thermal shrinkage properties and overall performance.

Career Highlights

Wakato Tomatsu is currently employed at Toyobo Co., Ltd., a company known for its advancements in materials and packaging solutions. His work has been instrumental in developing innovative products that meet the evolving needs of the packaging industry.

Collaborations

Tomatsu has collaborated with notable coworkers, including Tadashi Nishi and Hirokazu Ogi. Their combined expertise has contributed to the success of various projects and innovations within the company.

Conclusion

Wakato Tomatsu is a key figure in the field of packaging innovation, with a focus on multilayer body designs that enhance functionality and usability. His contributions continue to shape the future of food packaging technology.

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