Wai Keung Lo

Title: Innovations of Wai Keung Lo in Wireless Communication

Introduction

Wai Keung Lo is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of wireless communication through his innovative patents. With a focus on enhancing signal penetration, his work has the potential to improve communication technologies.

Latest Patents

Wai Keung Lo holds a patent for a device titled "Bendable resin having patterned elements for improving penetration of wireless communication signals." This invention provides a bendable resin that can be attached to a substrate to enhance the penetration of incidental radio waves. The device is designed to form one or more communication signal beams, allowing for improved signal transmission from one region to another. The resin consists of a base layer made from a first material, along with patterned elements created from a second material. These materials are selected from dielectric and metallic categories, and the patterned elements are engineered to tilt the radio waves, focusing them at predetermined points.

Career Highlights

Throughout his career, Wai Keung Lo has worked with several companies, including Antwave Intellectual Property Limited and Techtronic Power Tools Technology Limited. His experience in these organizations has contributed to his expertise in the field of wireless communication and patent development.

Collaborations

Wai Keung Lo has collaborated with notable coworkers such as Kung Bo Ng and Chun Kit Wong. Their combined efforts have likely fostered innovation and advancement in their respective projects.

Conclusion

Wai Keung Lo's contributions to wireless communication through his innovative patent demonstrate his commitment to enhancing technology in this field. His work not only showcases his inventive spirit but also highlights the importance of collaboration in driving advancements.