Company Filing History:
Years Active: 1994-1995
Title: W David Smith: Innovator in Multilayer Circuit and MCM Substrate Technologies
Introduction
W David Smith is a notable inventor based in Abington, Connecticut, who has made significant contributions to the field of circuit assembly and multichip module substrates. With a total of two patents to his name, Smith's work focuses on innovative manufacturing processes that enhance the performance and reliability of electronic components.
Latest Patents
Smith's latest patents include a "Method of manufacturing a multilayer circuit" and a "Method of manufacture multichip module substrate." The multilayer circuit patent describes an additive process that utilizes layers of fluoropolymer composite material and conductive materials. This innovative approach eliminates the need for a barrier metal layer, allowing for the creation of integral multilayer circuits with solid conductive interconnects. The multichip module substrate patent outlines a similar additive process, which incorporates multiple layers of fluoropolymer composite material and copper. This method promotes reliable bonding and allows for complex structures with multiple metal and dielectric layers, enhancing thermal management and electrical interconnections.
Career Highlights
W David Smith is currently employed at Rogers Corporation, where he continues to develop advanced technologies in circuit manufacturing. His expertise in additive processes and materials science has positioned him as a key player in the electronics industry.
Collaborations
Smith has collaborated with notable colleagues, including John A Olenick and Robert C Daigle, who share his commitment to innovation in electronic manufacturing.
Conclusion
W David Smith's contributions to multilayer circuit and multichip module substrate technologies reflect his dedication to advancing the field of electronics. His innovative patents and collaborative efforts continue to influence the industry positively.