W Boyd Rogers

Title: W Boyd Rogers: Innovator in Microelectronic Solder Bump Fabrication

Introduction

W Boyd Rogers is a notable inventor based in Raleigh, NC (US), recognized for his contributions to microelectronic device fabrication. He holds 2 patents that focus on advanced solder bump fabrication methods, which are crucial for enhancing the reliability and performance of microelectronic devices.

Latest Patents

Rogers' latest patents include innovative methods for solder bump fabrication that incorporate a titanium barrier layer. The first patent outlines a method for fabricating solder bumps on a microelectronic device with contact pads. This process involves depositing a titanium barrier layer on the device, forming an under bump metallurgy layer on top of it, and then creating one or more solder bumps on the under bump metallurgy layer. The method ensures that the solder bumps define exposed portions of the under bump metallurgy layer, which are subsequently removed. The exposed portion of the titanium barrier layer is also removed, protecting the underlying microelectronic device from etchants used in the process. This titanium barrier layer prevents the under bump metallurgy layer from leaving a residue on the device, thereby reducing the risk of electrical shorts between solder bumps.

Career Highlights

W Boyd Rogers is associated with MCNC, where he has been instrumental in advancing microelectronic fabrication techniques. His work has significantly contributed to the field, particularly in improving the efficiency and effectiveness of solder bump fabrication.

Collaborations

Rogers has collaborated with notable colleagues such as Joseph Daniel Mis and Gretchen Maerker Adema, enhancing the innovative efforts within his field.

Conclusion

W Boyd Rogers stands out as a key inventor in the realm of microelectronic solder bump fabrication, with his patents reflecting significant advancements in the industry. His work continues to influence the development of reliable microelectronic devices.