Company Filing History:
Years Active: 2019-2021
Title: Vincent Xue - Innovator in Wafer Level Chip Scale Packaging
Introduction
Vincent Xue is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor packaging, particularly in wafer level chip scale packages (WLCSP). With a total of two patents to his name, Xue continues to push the boundaries of innovation in this critical area of technology.
Latest Patents
Vincent Xue's latest patents focus on a wafer level chip scale package structure and its manufacturing method. The WLCSP structure comprises a semiconductor die and a stack that includes a protective tape and a molding compound. A unique feature of this design is that a portion of the first interface surface between the molding compound and the protective tape is curved. This innovative approach reduces the likelihood of cracks forming in the WLCSP structure. The manufacturing method involves several steps, including forming a semiconductor structure, attaching it to a dummy wafer, and performing a two-step dicing process with different cutting tools. The first cutting tool has a larger aperture than the second, which enhances the overall integrity of the package.
Career Highlights
Vincent Xue is currently employed at Alpha and Omega Semiconductor (Cayman) Ltd., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of WLCSP, making it a more reliable option for various applications in the electronics industry.
Collaborations
Vincent collaborates with notable colleagues such as Cheow Khoon Oh and Ming-Chen Lu. Their combined efforts contribute to the innovative projects at Alpha and Omega Semiconductor, fostering a collaborative environment that encourages creativity and technical advancement.
Conclusion
Vincent Xue is a key figure in the development of wafer level chip scale packaging technology. His patents and work at Alpha and Omega Semiconductor highlight his commitment to innovation in the semiconductor industry. Through his contributions, he continues to shape the future of electronic packaging solutions.