Endicott, NY, United States of America

Vincent M Fiacco


Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 49(Granted Patents)


Company Filing History:


Years Active: 1989-1996

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3 patents (USPTO):

Title: The Innovative Path of Vincent M. Fiacco

Introduction: Vincent M. Fiacco is a prominent inventor based in Endicott, NY, known for his contributions to electronic packaging technology. With a total of three patents to his name, Fiacco's work has significantly impacted the way electronic elements are assembled and integrated.

Latest Patents: One of Vincent M. Fiacco's latest patents focuses on an innovative electronic package assembly and connector. This invention involves a base member and cover member that work together to compress at least two circuitized substrates, including a ceramic substrate and multiple flexible substrates. One substrate is rigidly positioned within the base to protect and align it, while the flexible substrates are secured to the rigid substrate. The invention further introduces a resilient means that aids in maintaining the position of the flexible substrates throughout the assembly process. Upon securing the cover to the base, the elements achieve final compression, allowing the package to be electrically coupled to another circuitized substrate, such as a printed circuit board (PCB).

Career Highlights: Vincent has made notable contributions during his career, including his time at well-known organizations like IBM. His expertise in electronic packaging and assembly has earned him recognition in the field, solidifying his role as an influential inventor.

Collaborations: Throughout his career, Vincent M. Fiacco has worked alongside talented individuals, including coworkers Benson Chan and Fletcher L. Chapin. These collaborations have undoubtedly enriched his innovative process and broadened the impact of his inventions.

Conclusion: Vincent M. Fiacco's innovative work in electronic packaging continues to pave the way for advancements in the industry. With his unique approach and dedication to creating efficient solutions, he remains an influential figure in the realm of electronic assemblies. His contributions serve as a cornerstone for future developments in this dynamic field.

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