Company Filing History:
Years Active: 2012
Title: Victor Ososkov: Innovator in Copper Plating Analysis
Introduction
Victor Ososkov is a notable inventor based in Springfield, NJ (US). He has made significant contributions to the field of electroplating, particularly in the analysis of copper ions and complexing agents in copper plating baths. His innovative approach has implications for the semiconductor industry, where precise copper deposition is crucial.
Latest Patents
Victor Ososkov holds a patent for a method titled "Analysis of copper ion and complexing agent in copper plating baths." This patent describes a simple titration method that utilizes a copper ion specific electrode to determine the concentrations of both copper ions and bath complexing agents, such as ethylene diamine, in alkaline copper electroplating baths. The method involves standard addition and back-titration techniques, allowing for accurate measurements of bath components essential for effective copper deposition.
Career Highlights
Victor is associated with Eci Technology, Inc., where he applies his expertise in electroplating analysis. His work has been instrumental in developing methods that enhance the efficiency and accuracy of copper plating processes. With a focus on innovation, he continues to contribute to advancements in the field.
Collaborations
Victor has collaborated with notable colleagues, including Eugene Shalyt and Michael Pavlov. Their combined efforts have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Victor Ososkov's contributions to the field of copper plating analysis exemplify the importance of innovation in technology. His patent and work at Eci Technology, Inc. highlight his commitment to advancing electroplating methods.