Company Filing History:
Years Active: 2015
Title: Uwe Siedel: Innovator in Semiconductor Technology
Introduction
Uwe Siedel is a notable inventor based in Munich, Germany. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Uwe Siedel holds a patent titled "Through substrate features in semiconductor substrates." This patent describes a semiconductor device that includes a through substrate via disposed in a first region of a semiconductor substrate. Additionally, a through substrate conductor coil is located in a second region of the semiconductor substrate. This invention enhances the functionality and efficiency of semiconductor devices.
Career Highlights
Uwe Siedel is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to focus on advancing semiconductor technologies and contributing to the industry.
Collaborations
Uwe has collaborated with notable colleagues such as Gunther Mackh and Rainer Leuschner. Their combined expertise has fostered innovation and development in semiconductor technology.
Conclusion
Uwe Siedel's contributions to semiconductor technology through his patent and work at Infineon Technologies AG highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor devices.