Location History:
- Elsingen, DE (2004)
- Eisingen, DE (2001 - 2007)
Company Filing History:
Years Active: 2001-2007
Title: Ulrich Speer – Innovator in Substrate Joining Technology
Introduction
Ulrich Speer, an accomplished inventor based in Eisingen, Germany, has made significant contributions to the field of substrate joining technology. With a commendable portfolio of seven patents, Speer's innovative designs aim to improve processes in assembling optical data carriers and other substrate-based applications.
Latest Patents
Speer's recent patents showcase his expertise and innovative spirit. One of his notable inventions is a "Device for Joining Substrates," designed to join substrates with an inner hole, ultimately forming a substrate disk. This apparatus features an expandable element that can be introduced into the inner holes of superimposed substrates, effectively sealing off an intermediate space between them. Additionally, the invention involves a substrate support that can rotate about an axis perpendicular to its surface, enhancing operational efficiency.
Another noteworthy invention by Speer is a "Method and Apparatus for Joining Substrates," which significantly reduces cycle times in assembling substrates inside a low-pressure chamber. This method outlines a systematic approach to transferring substrates from one handling device to another, ensuring seamless assembly in a controlled environment.
Career Highlights
Ulrich Speer is proud to be associated with Steag Hamatech AG, a company at the forefront of technology advancements. His work has contributed tremendously to the efficacy of substrate assembly techniques, enhancing the reliability and functionality of optical data carriers.
Collaborations
Throughout his career, Ulrich has collaborated with talented colleagues like Klaus Weber and Stephan Leonhardt. These partnerships have fostered a dynamic exchange of ideas and innovations, further propelling developments in substrate joining technologies.
Conclusion
Ulrich Speer stands out as a pioneering inventor whose innovations have substantially impacted substrate joining methods. With his latest patents, he continues to push the boundaries of technology, ensuring that advancements in optical data carriers are both efficient and effective. His contributions not only highlight the importance of innovation in industry but also inspire future advancements in substrate technologies.