Munich, Georgia

Udo H G Meyer


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2005

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: Udo H G Meyer: Innovator in Cooling Systems

Introduction

Udo H G Meyer is a notable inventor based in Munich, Germany. He has made significant contributions to the field of cooling systems for hardware. His innovative approach combines liquid and air cooling solutions to enhance system performance and reliability.

Latest Patents

Udo H G Meyer holds a patent for a "System and method for cooling multiple logic modules." This invention presents a method and system for cooling hardware, which includes sensing hardware and supporting code streams. The design allows for a non-redundant liquid cooling system to work seamlessly with an air cooling backup solution. This dual approach provides the speed and reliability benefits of liquid cooling, while also ensuring that air cooling can take over during brief failures of the primary cooling system. When the liquid cooling system is under repair, the system clocks are automatically slowed to match the circuit speeds that are feasible at the higher temperatures associated with air cooling. Once the liquid cooling is restored, the system clocks return to their normal fast state. Additionally, the supplied voltage may be varied while the system is air cooled, depending on the circuit technology used.

Career Highlights

Udo H G Meyer is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced cooling technologies that are crucial for modern computing systems.

Collaborations

Udo has collaborated with notable colleagues, including Gary Franklin Goth and Daniel J Kearney. Their combined expertise has contributed to the advancement of cooling technologies within the industry.

Conclusion

Udo H G Meyer is a distinguished inventor whose work in cooling systems has paved the way for improved hardware performance. His innovative patent reflects a deep understanding of the challenges faced in maintaining optimal operating conditions for logic modules.

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