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Taoyuan, Taiwan

Tung-Po Sung

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Ccs Technology Corporation. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tung-Po Sung. Retrieved from https://idiyas.com/inventor/tung-po-sung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:

goldMedal5 out of 120 
 
Ccs Technology Corporation
 patents

Years Active: 2022-2025

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5 patents (USPTO):Explore Patents
1. 12354942 - 3D package configuration (2025-07-08),
2. 12255180 - 3D package configuration (2025-03-18),
3. 12159824 - 3D package configuration (2024-12-03),
4. 11373983 - 3D package configuration (2022-06-28),
5. 11257695 - Apparatus for transferring microdevice and method for transferring microdevice (2022-02-22),

Title: Innovations by Tung-Po Sung in 3D Package Configuration

Introduction

Tung-Po Sung is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of five patents. His innovative work focuses on advanced 3D package configurations that enhance the functionality and efficiency of semiconductor devices.

Latest Patents

Among his latest patents, Tung-Po Sung has developed a novel 3D package configuration. This innovation involves stacking a folded flexible circuit board structure on a package substrate, which is electrically connected based on the foldable characteristics of the flexible circuit board. The high temperature resistance of the flexible circuit board makes it suitable for various processes, including insulating layer, metal layer, photolithography, etching, and development processes. This design allows for the bonding of conventional semiconductor dies of various functions on one die and/or two sides of a flexible circuit board, ensuring efficient electrical connections in advance.

Another patent by Tung-Po Sung also focuses on a 3D package configuration. This invention similarly involves stacking multiple semiconductor package units or a folded flexible circuit board structure on a package substrate. The electrical connections are made based on the flexible circuit board's foldable characteristics and high temperature resistance, facilitating the bonding of semiconductor dies on one die and/or two sides of the flexible circuit board.

Career Highlights

Tung-Po Sung is currently associated with C

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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