Yokohama, Japan

Tsutomu Ohkawa


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 1978

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Tsutomu Ohkawa: Innovator in Thermosetting Resin Compositions

Introduction

Tsutomu Ohkawa is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of materials science, particularly in the development of thermosetting resin compositions. His innovative work has led to advancements that are crucial for various industrial applications.

Latest Patents

Ohkawa holds a patent for thermosetting resin compositions that exhibit excellent high-temperature performance. This patent involves thermosetting resin compounds produced by polymerizing together bismaleimide, which is expressed by a specific structural formula. The resin compositions are designed to enhance the durability and thermal stability of materials used in demanding environments.

Career Highlights

Tsutomu Ohkawa is associated with Toshiba Chemical Products Co., Ltd., where he has been instrumental in research and development. His expertise in polymer chemistry has allowed him to contribute to the advancement of high-performance materials. His work has been recognized within the industry for its innovative approach and practical applications.

Collaborations

Ohkawa has collaborated with Kiyoji Makino, a fellow researcher, to further explore the potential of thermosetting resins. Their partnership has led to significant insights and developments in the field, enhancing the overall impact of their research.

Conclusion

Tsutomu Ohkawa's contributions to thermosetting resin compositions highlight his role as an innovator in materials science. His work continues to influence the industry, paving the way for future advancements in high-performance materials.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…