Ibaraki, Japan

Tsunaki Kitahara

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 9.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Tsunaki Kitahara: Innovator in Foamed Sheet Technology

Introduction

Tsunaki Kitahara is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of innovative foamed sheet technology. His work has led to advancements that are applicable in various industries.

Latest Patents

Tsunaki Kitahara holds a patent for a foamed sheet that features a thickness ranging from 30 to 500 μm. This foamed sheet includes a foam with a density between 0.2 to 0.7 g/cm³ and an average cell diameter of 10 to 150 μm. Notably, the foam exhibits a peak top of loss tangent (tan δ) occurring within a temperature range of -30°C to 30°C. The loss tangent is defined as the ratio of a loss modulus to a storage modulus, determined at an angular frequency of 1 rad/s during dynamic viscoelastic measurement of the foam. The foam is designed to have a maximum loss tangent of 0.2 or more within the specified temperature range.

Career Highlights

Tsunaki Kitahara is currently employed at Nitto Denko Corporation, where he continues to innovate and develop new materials. His expertise in foamed materials has positioned him as a key player in the industry, contributing to the company's reputation for quality and innovation.

Collaborations

Throughout his career, Tsunaki has collaborated with talented individuals such as Kohei Doi and Kunio Nagasaki. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Tsunaki Kitahara's contributions to foamed sheet technology exemplify the impact of innovative thinking in materials science. His patent and ongoing work at Nitto Denko Corporation highlight his commitment to advancing the field.

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