Uji, Japan

Tsugio Nagasawa


Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 23(Granted Patents)


Location History:

  • Kyoto, JP (1984)
  • Uji, JP (1980 - 1993)

Company Filing History:


Years Active: 1980-1993

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3 patents (USPTO):Explore Patents

Title: Tsugio Nagasawa: Innovator in Thermal Transfer Technology

Introduction

Tsugio Nagasawa is a prominent inventor based in Uji, Japan. He has made significant contributions to the field of thermal transfer technology, holding a total of 3 patents. His work focuses on developing innovative materials that enhance the performance and efficiency of thermal transfer processes.

Latest Patents

Nagasawa's latest patents include a film for a thermal transfer ink ribbon and a high dielectric-constant film. The thermal transfer ink ribbon patent describes a film that possesses excellent heat stick resistance. This film comprises a base film made of a biaxially stretched thermoplastic resin and a thermally meltable or sublimable ink layer. A unique thin layer composed of various reactive and polymeric materials is formed on the opposite side of the base film, enhancing its functionality. The high dielectric-constant film patent reveals a film that can be produced easily and economically. It consists of one or more layers, with at least one layer containing a thermoplastic polymer and a ferroelectric substance, achieving a dielectric constant of at least 10.

Career Highlights

Nagasawa is currently employed at Unitika Ltd., where he continues to innovate and develop new technologies. His work has significantly impacted the industry, particularly in the realm of thermal transfer materials.

Collaborations

Some of his notable coworkers include Kazuo Matsukura and Kunio Murakami, who have collaborated with him on various projects.

Conclusion

Tsugio Nagasawa's contributions to thermal transfer technology exemplify his innovative spirit and dedication to advancing materials science. His patents reflect a commitment to enhancing the efficiency and effectiveness of thermal transfer processes.

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