Location History:
- Zentsuuji, JP (1992 - 1993)
- Kagawa, JP (1995)
- Zentsuji, JP (1979 - 1998)
Company Filing History:
Years Active: 1979-1998
Title: The Innovations of Toyoki Wano
Introduction
Toyoki Wano is a notable inventor based in Zentsuuji, Japan, recognized for his contributions to the field of packaging technology. With a total of seven patents to his name, Wano has made significant advancements in multilayer packaging films and heat-shrinkable films. His work has had a considerable impact on the packaging industry, enhancing the functionality and efficiency of packaging materials.
Latest Patents
Wano's latest patents include a multilayer packaging film that features a laminated structure with two outer layers and a core layer made of polypropylene resin. This innovative film incorporates specific ethylene-alpha-olefin copolymers and an anti-fogging agent, which improves its performance in various packaging applications. Another significant patent is for heat-shrinkable multilayer polyolefin films, which consist of outer layers made of polyethylene resin and inner layers that blend polypropylene resin with a linear ethylene/alpha-olefin copolymer. This design allows for enhanced shrinkage properties and durability.
Career Highlights
Throughout his career, Toyoki Wano has worked with prominent companies such as Okura Industrial Co., Ltd. and Sumitomo Chemical Company, Limited. His experience in these organizations has contributed to his expertise in developing advanced packaging solutions. Wano's innovative spirit and dedication to research have positioned him as a key figure in the industry.
Collaborations
Wano has collaborated with notable colleagues, including Kazuo Kondo and Teruo Tada. These partnerships have fostered a creative environment that has led to the development of groundbreaking packaging technologies.
Conclusion
Toyoki Wano's contributions to the field of packaging through his innovative patents and collaborations have significantly advanced the industry. His work continues to influence the development of efficient and effective packaging solutions.