Company Filing History:
Years Active: 2008
Title: Innovations by Toshikatu Takada
Introduction
Toshikatu Takada is a notable inventor based in Kohnan, Japan. He has made significant contributions to the field of multilayer printed wiring boards through his innovative patents. His work focuses on enhancing material properties and production processes in this important area of electronics.
Latest Patents
Toshikatu Takada holds a patent for a "Filling material, multilayer wiring board, and process of producing multilayer wiring board." This invention features a solvent-free filling material composed of a filler, a thermosetting epoxy resin, a curing agent, and a curing catalyst. The patent describes a multilayer printed wiring board that includes a substrate, a through-hole filled with the innovative material, and a conductor layer formed on the surface of the filling material within the through-hole. This invention highlights advancements in the production process of multilayer printed wiring boards by incorporating enhanced materials.
Career Highlights
Currently, Toshikatu Takada is employed by NGK Spark Plug Company, Limited, where he continues to develop innovative solutions in the field of electronics. His expertise and contributions significantly impact the company's mission to create advanced technologies for various applications.
Collaborations
Throughout his career, Toshikatu Takada has collaborated with talented colleagues such as Toshifumi Kojima and Makoto Wakazono. Their partnerships have led to successful innovation in electrical components, further establishing a tradition of excellence within their team.
Conclusion
Toshikatu Takada's work exemplifies the vital role of inventors in the electronics industry. His patent not only advances the technology used in multilayer printed wiring boards but also showcases the importance of collaboration among skilled professionals. As the field of electronics continues to evolve, inventors like Takada will undoubtedly play a crucial role in shaping its future.