Shizuoka, Japan

Toshihiro Maki


Average Co-Inventor Count = 2.5

ph-index = 6

Forward Citations = 123(Granted Patents)


Location History:

  • Shizuoka-ken, JP (1997)
  • Haibara-gun, JP (2004)
  • Shizuoka, JP (1991 - 2005)

Company Filing History:


Years Active: 1991-2005

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12 patents (USPTO):Explore Patents

Title: The Innovative Mind of Toshihiro Maki

Introduction: Toshihiro Maki, an accomplished inventor based in Shizuoka, Japan, has made significant contributions to the field of engineering, particularly in developing innovative methods for wire terminal connections. With a total of 12 patents to his name, Maki continues to advance technology in his industry.

Latest Patents: Among his recent inventions is a novel method and structure for connecting a terminal with a wire. This technology describes a method where the core of a wire is inserted into a tubular wire connecting portion of a terminal. The innovative crimping technique compresses the wire connecting portion radially and uniformly over its entire circumference. Utilizing a rotary swaging machine, rotating dies enable the wire connecting portion to achieve a true circular section shape, enhancing the reliability and performance of electrical connections.

Career Highlights: Toshihiro Maki is currently affiliated with Yazaki Corporation, a leading company known for its advanced electrical systems in the automotive and other sectors. His work at Yazaki has been instrumental in pushing the boundaries of connectivity solutions.

Collaborations: Throughout his career, Maki has collaborated with talented professionals, including Yasumichi Kuwayama and Masanori Onuma. These partnerships have fostered a creative environment, driving further innovations in terminal connections and similar technologies.

Conclusion: Toshihiro Maki exemplifies the spirit of innovation through his numerous patents and collaborative efforts. As he continues to develop cutting-edge solutions, his work not only symbolizes progress within Yazaki Corporation but also contributes to the broader engineering landscape globally.

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