Toshiaki Ono

Title: Toshiaki Ono: Innovator in Semiconductor Bonding Technology

Introduction

Toshiaki Ono is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of bonding wires. With a total of 3 patents to his name, Ono's work has paved the way for advancements in the efficiency and reliability of semiconductor devices.

Latest Patents

Ono's latest patents focus on innovative wire solutions for bonding semiconductor devices. One of his notable inventions is an inexpensive, very fine wire made of high-purity copper, which serves as an alternative to the fine gold wire currently used in the industry. This wire is prepared from a copper ingot with minimal impurities, ensuring high performance in bonding applications. The wire exhibits impressive characteristics, including an elongation of 5-22%, a breaking strength of 14-33 kg/mm², and a Vickers hardness of 38-50. By refining the copper and incorporating specific elements, Ono has developed a wire that minimizes the risk of damage during high-speed ball bonding processes.

Career Highlights

Throughout his career, Toshiaki Ono has worked with notable companies such as Mitsubishi Kinzoku Kabushiki Kaisha and Mitsubishi Denki Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Ono has collaborated with esteemed colleagues, including Naoyuki Hosoda and Naoki Uchiyama. These partnerships have further enhanced his research and development efforts in the field of semiconductor bonding.

Conclusion

Toshiaki Ono's contributions to semiconductor bonding technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials science and engineering, positioning him as a key figure in the advancement of semiconductor devices.