Tokyo, Japan

Toru Arimoto


Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 46(Granted Patents)


Company Filing History:


Years Active: 2002-2003

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2 patents (USPTO):Explore Patents

Title: Toru Arimoto: Innovator in Heat Pipe Technology

Introduction

Toru Arimoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic device design, particularly through his innovative heat pipe hinge structures. With a total of 2 patents, Arimoto's work exemplifies the intersection of engineering and technology.

Latest Patents

Arimoto's latest patents focus on a heat pipe hinge structure for electronic devices. This innovative design comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is constructed from a high heat-conductive material, strategically placed at the coupling portion where two housing portions meet. The hinge member includes a heat pipe hinge main body that effectively receives heat from a heat-generating component located in one of the housing portions. Additionally, a heat pipe holding portion is designed to pivotably hold a part of a first heat pipe in the other housing portion, ensuring efficient heat management. The hinge portion is made from a low heat-conductive material, which secures the heat pipe hinge member to at least one of the housing portions.

Career Highlights

Toru Arimoto is associated with The Furukawa Electric Co., Ltd., where he has been instrumental in advancing heat pipe technology. His work has not only contributed to the company's innovation portfolio but has also enhanced the functionality of electronic devices.

Collaborations

Arimoto has collaborated with notable coworkers, including Chiyoshi Sasaki and Hiroaki Maekawa. Their combined expertise has fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Toru Arimoto's contributions to heat pipe technology have positioned him as a key figure in the field of electronic device innovation. His patents reflect a commitment to improving device performance through effective thermal management.

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